GTS100AH-N（平面式高速固晶機(jī)）

（周期：50ms）

適用于2121,3014及2835,5050等


一、機(jī)型特性

1.采用國際領(lǐng)先的雙固晶，雙點(diǎn)膠，雙晶片搜尋系統(tǒng)；

2.采用直驅(qū)電機(jī)驅(qū)動邦頭；

3.采用線性電機(jī)驅(qū)動搜尋晶片平臺（X/Y）與送料平臺（B/C）；

4.采用可程式恒溫點(diǎn)膠系統(tǒng)；

5.采用真空漏晶檢測；

6.支架采用疊片式上料（免裝料盒），有效提高了生產(chǎn)效率；

7.工控機(jī)控制設(shè)備運(yùn)行，簡化了自動化設(shè)備的操作；
8.精準(zhǔn)的自動化設(shè)備為企業(yè)提高生產(chǎn)效率，降低成本提供了有效保障，從而切實有效地提高了企業(yè)競爭力；

9.精準(zhǔn)的固晶位置及優(yōu)良的一致性為后道工序提供了先天的保障。



GTS100AH-N

Plane-type High-speed Die Bonder

Cycle: 50ms

It is compatible with 2121、3014、2835 and 5050 etc.



Product Features

1.      International leading double die bond, double adhesive dispense and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Programmed control constant-temperature adhesive dispensing system is also applied;

5.      Vacuum die missing testing technology is adopted;

6.      Stacking holders for loading (free-loading magazine) is applied to improve the production efficiency largely;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.